As the only manufacturer to produce all of its own base materials with a patented process, we can manufacture printed circuit boards with an aluminium or copper core for you in FELAM-THERMOLINE® technology in the following designs:

• multilayer up to 6 layers
• double-layer with or without through-connections, symmetrical or asymmetrical
• single-layer with or without through-connections
• aluminium or copper core of between 1.0 and 4.0 millimetres
• UL approval for all FELAM THERMOLINE® products

Benefits for you:
The high heat dissipation of our FELAM-THERMOLINE® products will solve thermal problems, which arise from say using LED technology, controllers or transformers and other heat-intensive components on printed circuit boards.

Using FELAM THERMOLINE®

• you will avoid hot-spots under thermal components
• reduce or avoid additional cooling surfaces
• be able to transfer heat to housing surfaces
• avoid or reduce the need for additional aeration
• achieve a high mechanical and thermal load capacity for your printed circuit board
• replace the function of traditional heat sinks with a printed circuit board core made from aluminium or copper
• have the option of the printed circuit board being able to warp, making a 3D structure possible
• you will also have the option of specifically reversing this effect, making the specific generation of heat possible on the printed circuit board.

Particular product suitability:

• Printed circuit board as a carrier with outstanding heat dissipation for example for LEDs, transformers or other heat-intensive electronic components
• For the specific and direct generation of heat, for example to ensure a minimum operating temperature for components
• For generating heat from heating plates or heating ovens with precise control