We define FELAM THERMOLINE® as a special self-developed technology for avoidance and reduction of thermal problems which can arise through the usage of heat-generating assemblies on your printed circuit board.
Via special self-developed patented techniques we connect aluminium or copper cores with a pattern structure. With this production process we can produce a multilayer with up to 3 layers, symmetric and asymmetric.
Through this way of production we are independent of preassembled materials of other manufacturers.