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Printed circuit boards from the FELAM THERMOLINE® product range are designed especially for better heat dissipation when using heat-producing components but the specific placement and transfer of heat can also be implemented for your specific scenario.
FELAM THERMOLINE® benefits:
- Low operating temperature
- Reduced printed circuit board size
- Increased power densities
- Extended component and product service lives
- Fewer connection points
- Improved thermal and mechanical rating
- Combination of power and control electronics
- Better use of SMD technology
- Elimination of or reduction in heat sinks and other mechanical add-ons
- Robust and simple alternative to sensitive ceramic substrates
We use both aluminium (thicknesses of between 1.0 and 4.0 mm) and copper (thicknesses of between 1.0 and 3.0 mm) with different dielectric fluids, which have a heat dissipation value of between 0.3 and 3.0 W/mK, as our heat dissipation material. The conductive pattern is configured in copper layer thicknesses of between 18 and 105 µm as you request.
We can combine
| Copper layer, conductive pattern |
18 µm, 35 µm, 70 µm, 105 µm |
| Dielectric fluid |
60 - 420 µm depending on requirement for dielectric strength |
| Carrier material |
Aluminium: 1.0 - 4.0 mm
Copper: 1.0 - 3.0 mm |
- Copper layer, conductive pattern
- Dielectric fluid
- Carrier material
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Technologies 
