In order to satisfy the needs of your equipment and connection technology and the standard requirements of RoHS and WEEE, we coat the printed circuit board surfaces with the following materials:

• tin/copper/nickel with the HAL procedure (Hot-Air-Levelling)
• tin/lead with the HAL procedure
• chemical tin
• chemical nickel/gold
• galvanic nickel/gold
• chemical silver

As an alternative for chemical nickel/gold, we can coat partially with

• carbon using the screen printing procedure